A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Re: Contact angle between water and silicon or silica
Re: Contact angle between water and silicon or silica
2003-04-25
Gabriel, Markus
Re: Contact angle between water and silicon or silica
Gabriel, Markus
2003-04-25
Dear Danny,

it absolutely depends on the surface conditioning of silicon or silica. The
surface condition can be prepared by special wet or dry chemical treatments.
We deal with direct wafer bonding issues. Before bonding among other things
the wafer surfaces must be treated to get eighter a high hydrophilicy (very
small contact angle) or hydrophoby (very high contact angle). The surfaces
are then determined by OH-groups (hydrophilic surface) or by H-groups
(hydrophobic surface). Each extrem state is very reactive to the ambient
species, so the contact angle change after time (a king of aging effect).

Regards,
Markus.

SUSS MicroTec
Business Field MEMS
Markus Gabriel
Schleissheimer Str. 90
85748 Garching
Germany
Fon     +49 89 32007 - 313
Fax     +49 89 32007 - 390
email   [email protected]
http://www.suss.com/mems


Dear Members,

Does anyone know the contact angle between water and silicon or silica? Can
anyone recommend a good website where this data could be found ?
Has anyone ever dealt with interactions between surfactants solutions and
silicon or silica?

Thank you in advance,

Danny Klein
-----------------------------------------------------

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Addison Engineering
Process Variations in Microsystems Manufacturing
MEMStaff Inc.
Tanner EDA by Mentor Graphics