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MEMSnet Home: MEMS-Talk: bonding
bonding
2003-06-18
mems greenhorn
2003-06-25
Yun Xi
bonding
mems greenhorn
2003-06-18
I have a microchannel etched on a quartz substrate ..the chip size is 1cm x 3cm
with gold layer on it which was a masking layer during the glass etch.For the
capping wafer I am using a microscope glass slide. At present I use epoxy at the
edges to bond the glass slide to  the chip.There is no leakage out of the
channel this way.But at the interface i.e at area of contact between the surface
of the chip and the top slide some liquid seeps in.Is there any simple solution
to prevent this ?


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