Hello all,
I am trying to bond micromachined silicion wafers with 5 um epitaxial layer,
I actually bond both wafers but I can´t eliminate the critical bend in 5um
membrane
generated by the thermal residual stress.
Can anyone let me know a good paper about this subjet or send me some
information?
Thanks in advance,
Jon Ander Etxeberria
Sección de Microelectrónica CEIT
Paseo Manuel Lardizabal, 15
20018 San Sebastián
SPAIN
Tfno: 34 943 212800
Fax: 34 943 213076
e-mail: [email protected]
