Plan Optik GmbH in Germany produces glass (e.g. Pyrex) wafers with holes.
The wafers can be from 100 microns (thickness) up to 5000 microns. The wafer
size can be from 1" to 12". The minimum hole diameter is approximately 500
microns (there is no maximum hole diameter). For that a newly developped,
numerically controlled, ultrasonic drilling process (so called USHD) is
used.

More information can be found at http://www.planoptik.com/page-engl/77.html

Carsten Wesselkamp
Plan Optik GmbH
mailto:c.wesselkamp@planoptik.com



-----Original Message-----
From: Bill Flounders [mailto:bill@eecs.berkeley.edu]
Sent: Monday, July 07, 2003 6:03 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Making holes in Pyrex glass wafers?


Alternate Ultrasonic Machining Contact:
Perhaps related?

J.A. Anderson Associates
Precision Glass/Ceramics and Ultrasonic Machining
630-377-6565
john@jaanderson.com
www.jaanderson.com

Bill Flounders, Ph.D.
Technology Manager
Berkeley Microlab




Kirt & Erika Zipf-Williams wrote:
>>Hi, We are looking for supplier who can drill more than 1 mm holes on
>
> thick
>
>>(1 mm) Pyrex glass wafers. Please write to propak@singnet.com.sg Regards.
>
>
> Check with Sensor Prep Services in Illinois at 630-365-9645.
> They do ultrasonic drilling through even thicker glass.
>
>     --Kirt Williams, Ph.D.   consultant
>
>
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