You can refer to the book "Fundamentals of Microfabrication" by Madou.
Such technique is well explained in the book as well as in other
literatures.

Best,
ShuTing
Electrical Engineering, UCLA



-----Original Message-----
From: mems-talk-bounces+shuting=ucla.edu@memsnet.org
[mailto:mems-talk-bounces+shuting=ucla.edu@memsnet.org] On Behalf Of
Yilei Zhang
Sent: Monday, July 14, 2003 10:37 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] silicon trench wet etching


Dear members:
I have a question about silicon trench wet etching. If etched from back
side,
for example, 2um mask dimension, how wide the trench will be in the
front side
with wet etching? I know this depends on the orientation of wafer and
the
trench direction. According to the book, if the trench is aligned
accurately,
it is possible to get a vertical side wall, thus, the width in front
side will
be the same as that in back side, say, 2um.

I donot know whether it requires very high accuracy to alignment in
order to
get vertical side wall. If I do the alignment manualy, generally how
thin i
can get in the front side? Is there anybody has experience in this area?


thanks.

Regards,
Yilei Zhang










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