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MEMSnet Home: MEMS-Talk: Market Size for different Wafer Bonding Methods?
Market Size for different Wafer Bonding Methods?
2003-08-07
Tom Molamphy
2003-08-08
Michaela Wullinger
2003-08-07
Maurice Norcott
Market Size for different Wafer Bonding Methods?
Maurice Norcott
2003-08-07
Contact Dr.Farrens @ EV Group, she can probably answer
most if not all of your questions on IR inspection and
bonding methods for MEMS.

602-437-9492 or 602-432-9406 cell

-----Original Message-----
From: Tom Molamphy [mailto:[email protected]]
Sent: Thursday, August 07, 2003 8:46 AM
To: [email protected]
Subject: [mems-talk] Market Size for different Wafer Bonding Methods?


Hi All,

Any idea on where I might find market data for use of different wafer
bonding methods for MEMS? Any opinions on likely winners in this technology
moving forward?

Thanks,

Tom

________________________________________________

Tom Molamphy

Phoseon Technology

Office: 970 266 8097

Cell: 970 443 1864

Fax: 970 267 0801

www.phoseon.com







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