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MEMSnet Home: MEMS-Talk: Re: Glass-Glass thermal fusion bonding
Re: Glass-Glass thermal fusion bonding
2003-08-13
Markus GABRIEL
2003-08-13
Brubaker Chad
Re: Glass-Glass thermal fusion bonding
Markus GABRIEL
2003-08-13
Date: Mon, 11 Aug 2003 16:12:28 -0500
From: Balaji Srinivasan Venkatesh 
Subject: [mems-talk] Glass-Glass thermal fusion bonding
To: [email protected]
Message-ID: <[email protected]>
Content-Type: text/plain; charset=us-ascii

Hi..
     I would like to do a Glass-Glass Fusion bonding  without any intermediate
layer ..Does it require any particular type of glass and can anybody let me know
the protocol for this kind of bonding.

Also any suggestion on UV Bonding of glass would be of help..

Thank You,
Balaji



Balaji,

in fact glass-glass bonding can be performed without intermediate layer. Same
requirements are valid as for Si-Si bonding regarding macroscopic and
microscopic roughness. Additional planarization step sometimes is necassary
before bonding to achieve the required values. Cleaning and hydrophilizing can
be done in HNO3 or SC1 in case of Quartz. Final rinsing in DI water + Megasonic
is recommended. Particle removal is a more severe problem for quartz bonding
than for Si bonding.
So prepared glass wafers should bond spontaneous at room temperature like Si-Si.
Annealing temp. can vary between 250 and 500 deg C (material dependent). A
problem might be void creation during the anneal process, but can be prevented
by additional steps.

Regards,




Markus Gabriel
Suss MicroTec Inc.
228 Suss Drive
Waterbury Center, VT 05677 USA
Tel.: +1 - 802 - 244 - 5181, ext. 380
Fax: + 1 - 802 - 244 - 7271
[email protected]
www.suss.com


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