Hello Justin,
Did you consider making stress release lines in the
metal film, Stress release lines are quite effective
in breaking the built up stress which is otherwise
present in a blanket film.
Regards,
Kiran.
Hello,
I have an application where I have deposited a very
thick film of metal on
the front side of my silicon wafer and then wish to
process it through a
number of additional steps near the end of the process
flow, but the problem
is that the sheet-deposited film stress is so huge
that it induces over
200-microns of wafer bow, compressive. With so much
bow on the wafer, none
of my process tools want to pick the wafer up during
the proceeding steps.
My question is, is there some method of performing a
backside process to
cause the film/wafer combination to relax somewhat to
a lower wafer bow, to
better allow for vacuum-arm wafer pickup? I think
annealing is not an
option due to the nature of the metal film; it will
only become more
compressive at the temperatures I could anneal.
Thanks for any thoughts,
- Justin
Justin C. Borski
MEMS Program Manager
Advanced MicroSensors Inc.
[email protected]
www.advancedmicrosensors.com
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_______________________________________________
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Kiran Potluri
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