You should use some other adhesion material. Most popular is Ti or Cr. Ti
is lower stress, while Cr resists BOE/HF etch.

Jesse Fowler
  UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV
  Los Angeles, CA 90095-1597 | (310)825-3977
"Facts are stubborn, but statistics are more pliable."
   -- Mark Twain

On Mon, 8 Sep 2003, [iso-8859-1] Ah Gong wrote:

> will the contact be good if depositing gold onto a
> silicon dioxide or should add some adhesion 4 better contact????
>
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