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MEMSnet Home: MEMS-Talk: Cu Electroplating: Thanks
Cu Electroplating: Thanks
2003-09-16
sajid
2003-09-17
Brad Cantos
Cu Electroplating: Thanks
sajid
2003-09-16
Hi all,

        I got some very useful responses from Eric and Amrit. Thanks
guys! I'm in the process of trying to use the suggestions put forth by
you guys. Sorry for the late response. I had to think over the problem
for sometime.

Eric, I tried searching (google :) ) for the JUMP software without
success. Could you give me a few more details on where to find it?

And as per your suggestion I asked my suppliers about the additives (Lea
ronal PCM) and found out that they had never had success with reverse
pulsing!!! So I've now shifted to just forward pulsed currents. I now
get better copper quality! And better throwing power. But I still have
not achieved superfilling.

Amrit, the current density I use is 10-15 mA/cm2. I found higher current
densities gave me poorer filling for my geometry. And thanks for your
explanation of additive functions. It gave me a clearer insight.

I will definitely keep you guys posted on any progress made.

Thanx,

Sajid



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