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MEMSnet Home: MEMS-Talk: Vacuum packaging for Sensor devices
How to etch gold ( 3 micron thick0
2003-09-25
gokul ramamani
2003-09-25
Kirt & Erika Zipf-Williams
Vacuum packaging for Sensor devices
2003-09-28
Absara Micro Systems
2003-09-26
kris
2003-09-26
Mighty Platypus
Vacuum packaging for Sensor devices
Absara Micro Systems
2003-09-28
Hi All,
Absara Micro Systems have developed a new vacuum package with following
features:
Low cost, Low Temperature, High Throughput, Very Reliable, Vacuum Levels
(currently <10 milli torr), High packaging yield.
Gautham V; ABSARA MiCRO SYSTEMS(S) PTE LTD
e-mail: [email protected]; website: www.absaramicro.com





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