Dear All,

My device is a thermal in-plane actuator made by MUMPs
process. It moves mainly forward in-plane under
applied voltage though a little downwards motion
occurs. However, the weird thing is that after the
wire bonding, the device only moves down. I have
tested a bunch of devices, which all show this
behavior. I donnot think stiction is the reason
because stiction is also existing before the wire
bonding. I am curious what's the cause and how to
avoid this.

Many thanks,

Yong

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