Hi all!

Our research group is investigating LIGA based electrostatic actuation. We have
run into problems with the choice of the substrate. Simple calculations show
that stray capacitance from the substrate may cause a lot of problems.

We are considering the use of SiNx or SiO2 on a 4" wafer, followed by the
evaporation/ sputtering of gold for the plating base. The gold is to be etched
away after the fabrication of nickel microstructures.

Can someone tell me typical thickness of Si02/SiNx needed to minimize the
capacitative effects from the Si substrate? What does MCNC use for its MUMPS
runs?

Sincerely,

Sandeep Akkaraju

Sandeep Akkaraju                           Ph: 504/388-6487 (Off)
Graduate Research Assistant                    504/769-9487 (Home)
Microsystems Engineering Team,LSU          Fax:504/388-5924
WWW:http://www.lsu.edu/~muset/sandeep/