Dear MEMS researchers,
we want try to remove Al-ultrasonic bond technique by glue-technique.
I know that this is a problem, but it would be helpful for us, to go on
using Al-pads.

Have anybody sucsessful conductive glued Al. Does anybody knows a
provider for conductive paste which can be used for this problem.

Thanks in advance

Dirk Zielke
[email protected]