Hey Ashari

   Aluminum is soluble in both acidic and basic solutions and is not an
ideal seed layer. The typical seed layer used for electroplating is titanium
followed by copper.

   Regards
   Sreeram

-----Original Message-----
From: [email protected]
[mailto:[email protected]] Sent: Tuesday,
December 16, 2003 2:59 AM
To: [email protected]
Subject: [mems-talk] seed layer for nickel elctroplating

Is there a way to electroplate nickel onto aluminium
coated wafer as im unable to do so currently. Whats
the best seed layer for nickel electroplating.

=====
ashari keling



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