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MEMSnet Home: MEMS-Talk: via through pyrex
via through pyrex
2003-12-15
Paolo Bondavalli
2003-12-17
David Nemeth
2003-12-17
Steven F. Nagle
2003-12-17
Choe,S-H
2003-12-16
[email protected]
via through pyrex
David Nemeth
2003-12-17
Dr. Bondavalli,

Putting holes in pyrex can be accomplished by either laser drilling or
ultrasonic drilling.  There are several companies that offer these services.
http://www.atceramics.com/ is one such company I've worked with in the past.
They will also deposit and pattern metal to form via holes.  The quoted
accuracy is about 25 microns, which may or may not be suitable for your
application.  The other limitation is that the ratio of hole diameter to
wafer thickness shouldn't be much less then 1.

There are many others, a google search should turn them up.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On
Behalf Of Paolo Bondavalli
Sent: Monday, December 15, 2003 12:04 PM
To: [email protected]
Subject: [mems-talk] via through pyrex


Hi all!
I'm looking for refrences, papers, articles related to realization of
via in pyrex wafer using Drie etch process and metalization of these
ones.
Thank you very much.

*********************************************************
Dr. Paolo Bondavalli
R&D MEMS Engineer
MICROTEC MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : [email protected]
**********************************************************
Disclaimer: Opinions expressed herein are my own and may
  not represent those of my employer.
**********************************************************



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