Woo,

If there is a gap between the glass slides and wafers, the slides may have poor
shape. A method that has been used before is to put them together without the
pre-bake on the SOG and then do a overnight low temp (50C) bake followed by the
slow ramp and anneal at higher temp the next day. But if possible, glass made
for bonding with good flatness and roughness specifications should be used.


Best Regards,

Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
[email protected], www.EVGroup.com

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 -----Original Message-----
From:   [email protected] [mailto:mems-talk-
[email protected]]  On Behalf Of Chieh Jayne Woo
Sent:   Monday, January 19, 2004 5:11 PM
To:     General MEMS discussion
Subject:        [mems-talk] the gap between substrates of wafer-bonding

Hello,
I need help with chemical wafer-glass bonding.
I am trying to bond glass slides to wafers with spin-on glass 400F
(methylsilsesquioxane).  I spin on SOG on the glass at 4000 rpm, bake
on hot plate at 90 C for 60 seconds, clamp onto the Si wafer and bake
in an oven at 200 C for 4 hours.
The problem is there is always a few micron gap between glass and Si
wafer no matter how tight I clamp the two pieces together.  The two
pieces are still held together at some places.
I wonder if anyone can help me to get rid of the gap.

Thank you very much,
Woo

University of Notre Dame
Notre Dame, IN 46556



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