Hi,

Does anyone has experience by using DRIE for backside cantilever releasing?
My problem is I have to either bond my wafer to another wafer using
photoresist or coat wafer backside with SiN to avoid etching of chuck when
my wafer is etched through. Since the cantilever is very frigile, I worried
afte r the process, how to seperate the bonded wafer or etch SiN without
damage my cantilever. My cantilever materials is SiO2. Any suggestion?
Thanks!


Juntao

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