Hi Juntao,

Do you have a polymide electro static chuck or a ceramic chuck?
If it is a ceramic chuck, maybe it can take on a little more of the
abuse from
plasma. (Assuming you are not runing production.)

Otherwise, try attching your wafer with thermal paste. Dab it on the
parts of the backside where you do not mind being dirtied. Put the wafer
on
your carrier and send it in for etching. Since you are releasing, I am
assuming
you do not concern too much about profile or such. Otherwise, you should
do
a test run since wafer temperature is not going to be the same, which
affects
the profile.




-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of
Juntao Xu
Sent: Thursday, January 29, 2004 7:37 AM
To: [email protected]
Subject: [mems-talk] DRIE for cantilever release


Hi,

Does anyone has experience by using DRIE for backside cantilever
releasing?
My problem is I have to either bond my wafer to another wafer using
photoresist or coat wafer backside with SiN to avoid etching of chuck
when
my wafer is etched through. Since the cantilever is very frigile, I
worried
afte r the process, how to seperate the bonded wafer or etch SiN without

damage my cantilever. My cantilever materials is SiO2. Any suggestion?
Thanks!


Juntao

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