Hi Frank,

        Perhaps you wanna try removing O2 from your plasma chemistry or
increasing your RIE power?


Yours sincerely,

Isaac Chan

Ph.D. Candidate
Dept. Electrical & Computer Engineering
University of Waterloo
200 University Ave. W
Waterloo, Ontario, Canada
N2L 3G1
Tel: (519) 888-4567, ext. 6014
Fax: (519) 746-6321
[email protected]
http://www.ece.uwaterloo.ca/~a-sidic


On Fri, 13 Feb 2004, frank berisford wrote:

> Hello all,
>
> Over the past few weeks I've been trying to get a highly anisotropic silicon
> dioxide etch recipe for 2 different feature sizes.  I was able to obtain
> acceptable results on 0.5 micron features.  However the recipe didn't work so
> well for larger (50 micron) features.  My current recipe is a CHF3/O2
chemistry
> at very low power and flow rates.  My optimised etch for the small features
has
> no effect on the larger features other than decreased etch rate.
>
> Thanks for any insight you can offer,
> Frank
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>