Assuming you are using a positive resist for lift-off, coat the back
with a negative resist.

-Mike


>>> [email protected] 2/12/2004 4:34:39 AM >>>

Dear all,

We are carrying out some experiments involving patterning
the surface of a 'compound semiconductor' material
on a wafer (backface is polished Si)
using 'THE LIFT-OFF TECHNIQUE'.

Material is e-beam deposited onto pattern resist.

We are finding that 'unwanted' material' is clinging onto the
back of the silicon polished face after lift-off.

Any suggestions about how to minimise this hydrophilic
effect?

regards

philip lau


********************************************************************
This email and any attachments are confidential to the intended
recipient and may also be privileged. If you are not the intended
recipient please delete it from your system and notify the sender.
You should not copy it or use it for any purpose nor disclose or
distribute its contents to any other person.
********************************************************************

_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk

Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/