Hello, everyone

I am working on AZ 5214 and trying to get reversed image with nice undercut
profile. So for, I can only get vertical profile, which caused a big problem
for lift-off process.

The substrate I am using is highly doped silicon deposited with SiO2 (200nm).
The recipe I tried is as follows:
prebake 90-100 degree 45-60 sec
image exposure   2-5 sec at 10mW/cm^2 (Karl suss MJB3)
PEB   115 degree   20-60 sec
Flood exposure  15-40 sec at 10mW/cm^2
Develpment   20-30 sec in AZ 400K (1:4)


When I tried to increase exposure dose and PEB time, some inversed
patterns(<10um) were gone and develpment became very diffult.The profile is
overcut.  When the exposure dose is low and PEB time short, I can get small
features in the inversed patterns, but the small gaps (the parts with
photoresist)between the inversed patterns are develped away easily . At this
time, the profile is vertical because of overdevelpment.


Does anyone has experience with AZ 5214?  Please give me some suggestion about
this problem.


Thanks,