Dear Sir.

I am trying to pattern a thick metal layer on InP. The thickness could
be 1.5 um to 2 um. The pattern I try to make is a 5 X 100 um^2 rectanglular
openning. This pattern should be done with image reversal process for lift-
off deposited metal.
This pattern could be achieved with AZ5214 by image reversal process.

I have two questions. One is that "AZ4330 could be patterned with image
reversal process?"
The other question is that "What is a condition of AZ4330 image reversal
process,
for example, pre-baking temperature and time, exposure energy, reversal
baking temperature and time,
developer and developing time?'

Thanks a lot for your help in advances.

Best regards.

Chung, Yong-Duck
Senior engineer/Ph. D
Electronics and Telecommunications Research Institute
Tel : 82-42-860-1524
Fax : 82-42-860-6248
Mobile : 82-16-364-5917
E-mail : [email protected]