I have deposited gold film using Ebeam evaporation
onto a substrate with low-stress nitride, afterwards I
deposited 2um of PECVD oxide.  After that some of the
gold pads popped up.  I am wondering if it is due to
the poor adhesion of gold (I used 200A of Ti as
adhesion layer), or is it because of the stress
between gold and PECVD oxide.

Anyone has any experience to share?

Thanks!

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