Successful use has been shown with filled and non-filled epoxies, with
polyimide ( both types: non hermetic) as well as with BCB (in thin layers
nearly hermetic!)
epoxies are very easy processed, PI is readily available but cures at high
T, BCB is lower in cure but requires nitrogen ambient and is not very easy
to come by.
If you have compiled a list, the community would likely be happy if you
share it via the MEMS group

Regards!

-----Ursprungliche Nachricht-----
Von: [email protected]
[mailto:[email protected]]Im Auftrag von
Robert Dean
Gesendet: Donnerstag, 4. Marz 2004 17:01
An: General MEMS discussion
Betreff: [mems-talk] adhesive based wafer bonding


Hello,

Does anyone know which adhesives have been successfully used to bond
silicon wafers together, in place of fusion, anodic, gold thermocompression
or eutectic solder wafer bonding?

Sincerely,

Robert Dean
Auburn University


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