Dear Mr. Dean,

adhesive bonding is very often used to join two silicon wafers together. A
very common layer is BCB, polyimide or SU-8. Please check the following
webpages for more informations about adhesive bonding:
BCB:
http://www.s3.kth.se/mst/research/publications/pdf/2000/MEMS00pp247_252FN.pd
f
http://www.ee.ucla.edu/~jjudy/classes/ee250a/papers/Niklaus_Microassembly.pd
f
SU-8
http://www.mic.dtu.dk/research/mems/publications/Papers/Bilenberg_Eurosensor
s03.pdf

Best Regards,
Margarete Zoberbier

----------------------------------------------------
SUSS MicroTec
Applications Center RSC Europe
Margarete Zoberbier
Schleissheimer Str. 90
85748 Garching
Germany
Phone   +49 89 32007 - 380
Fax     +49 89 32007 - 390
email   [email protected]

------------------------------

Message: 3
Date: Thu, 04 Mar 2004 10:01:10 -0600
From: Robert Dean 
Subject: [mems-talk] adhesive based wafer bonding
To: General MEMS discussion 
Message-ID:
        <[email protected]>
Content-Type: text/plain; charset="us-ascii"; format=flowed

Hello,

Does anyone know which adhesives have been successfully used to bond
silicon wafers together, in place of fusion, anodic, gold thermocompression
or eutectic solder wafer bonding?

Sincerely,

Robert Dean
Auburn University