Dear All:
I plan to coat Cr and Au on silicon and than put it in conc.HF for 30min, now I
find some problem. now I plan to coat layer of polyimide on Au before HF as a
protecting layer
1. the adhension of polyimide to Au is good enough?
2. if the polymide is fully cured, can I get rid of it by oxygen plasm?
Thanks in advance!
Lili
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