JW,
Try slower ramping to your soak power (just to the melting point), then a
slower ramp to your pre-dep power that should be set 1 or 2% lower than dep
power. I have a dual shutter system that I open my lower shutter for 100A
for the system to settle before the upper shutter opens. I need a very
accurate film thickness.
Be sure you have melted in your new Au slowly and completely before trying
the above. I too have blown all my Au out of the pocket, but that was back
in the 80's.
Brent
J W wrote:
> Hi,
>
> I'm trying to deposit gold using Ebeam evaporation,
> but kept having metal spitting problems. I tried to
> change the equipment running conditions like longer
> soak time, soak power close to deposition power,
> altering beam sweeping pattern. Sometime it improves
> and other time it doesn't. Are there any other
> factors that needs to be considered to get rid of the
> spitting?
>
> Thanks!
> J.W.
>
> __________________________________
> Do you Yahoo!?
> Yahoo! Mail - More reliable, more storage, less spam
> http://mail.yahoo.com
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/