Hi All,

I have a layout design of the metal (gold) lines connecting the sensor to
the outside and I wish to place bond pads on the periphery of the sensor
die. However, I have no experience in the wire bonding area. Could anyone
that has knowledge in this area suggest the dimensions and thickness of the
bond pads I should have? And if the thickness of the bond pads is different
than that of conducting lines, that means I need to have an extra mask just
to define the pads??

Thanks you,
Tom