Hello Tom,

Wire bonding depends on the dimension of the tool(needle) being used for
bonding and also the wire diameter you would be using eg. gold or aluminum.
In my case I can go upto 50 x 50 um contact pads.


Aasutosh Dave



>From: Chen-Chuan Fan 
>Reply-To: General MEMS discussion 
>To: [email protected]
>Subject: [mems-talk] Bond pads
>Date: Sun, 21 Mar 2004 20:58:47 -0700
>
>Hi All,
>
>I have a layout design of the metal (gold) lines connecting the sensor to
>the outside and I wish to place bond pads on the periphery of the sensor
>die. However, I have no experience in the wire bonding area. Could anyone
>that has knowledge in this area suggest the dimensions and thickness of the
>bond pads I should have? And if the thickness of the bond pads is different
>than that of conducting lines, that means I need to have an extra mask just
>to define the pads??
>
>Thanks you,
>Tom
>
>
>_______________________________________________
>[email protected] mailing list: to unsubscribe or change your list
>options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>Hosted by the MEMS Exchange, providers of MEMS processing services.
>Visit us at http://www.memsnet.org/

_________________________________________________________________
All the action. All the drama. Get NCAA hoops coverage at MSN Sports by
ESPN. http://msn.espn.go.com/index.html?partnersite=espn