>Hi, MEMS-Talk members.
>
>I am Yonduck Sung, a master student at CMU, who is trying to make very thin
>microchannels (width 5um, height 1um) with PDMS. To make these small
>channels,
>I am going to use etched oxide layer as a mold; 1 um oxide layer on Si
>substrate was patterened and etched for this purpose, on which PDMS will be
>poured to form microchannels.
>
>However, as channel dimension is so small, I am afraid of deformation or
>destruction of these PDMS microchannels when stripping them off from the
>mold.
>So I want to hear from you to get some advice about ways to peel off PDMS
>more
>easily from the mold. Any answer will be greatly appreciated.
>
>Then have a nice day. I thank you in advance.
>
>
>Thanks,
>Yonduck Sung
>
>Graduate student
>Carnegie Mellon Mechanical Engineering
>5000 Forbes Av, HH B120
>Pittsburgh, PA 15213
>
>Phone : 412-268-2514
>Email : [email protected]
>
Hi Yonduck

  You can use the STS to deposit a teflon like layer to help you peel PDMS
off the substrate.  Usually a two minute run of only passivation gases using
the standard recipe should be sufficient for your needs.  The layer should
last you for about 5-10 runs before you need to remove the layer and
redeposit the coat.  You also need to recondition the STS chamber after you
run this process.

Phil Tabada

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