One way is to get holes drilled through the wafers, then deposit metal so
that the insides of the holes are coated.  Many companies offer services for
laser drilling.  The hole diameter can ussually get no smaller than the
thickness of the wafer.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA

-----Original Message-----
From: [email protected]
[mailto:[email protected]]On
Behalf Of Cédric margo
Sent: Tuesday, March 23, 2004 10:26 AM
To: [email protected]
Subject: [mems-talk] electric connection


Hello,
I would like to know if it is possible to make vias for electrical
connections in glass plates. More precisly, I want to bond two glass
wafers, on one side(the side which must be bonded)  of each wafer ,
there would be electrodes and interconnections (gold or platinium)
processed by lifft-off. After the glass wafers are bonded, my problem is
to make electrical connections to the outside world.For that, is it
possible to make metals vias through the glass plates to be connected
with macroscopic wires or do you know other kinds of methods to do that?

All the suggestions would be interesting for me because I am not well
familiar yet with microfabrication processes.
Thanks .

-- --
Cédric Margo - [email protected]
Laboratoire d'Instrumentation Electronique de Nancy
Faculté des Sciences et Techniques
Boulevard des Aiguillettes - BP 239
54506 Vandoeuvre les Nancy - FRANCE
Tel:03 83 68 41 56
fax:03 83 68 41 53
http://www.lien.uhp-nancy.fr



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