Bill,

Try platinum (you may want to use titanium and/or chrome as
adhesion layers first).

marc

--
Marc Straub
Sr. Engineer, Solidus Technologies, Inc.
Colorado Springs, CO

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On Tue Mar 2 15:43:47 EST 2004 William Lanford-Crick wrote:

Hi group,
I need a conductive barrier metal to prevent Gold from
diffusing into ohmic metal after 850deg C annealing.

50 nm Moly is OK.  Surface morphology is still somewhat
rough after annealing.  Any ideas of what might be better?
-Bill