As we just got a STS-Cluster Tool for the ASE (Advanced Silicon Etch) and AOE
(Advanced Oxide Etch) Processes, we are looking for a photoresist as masking
material.
We will probably need different resists for different etch-depths and
different feature sizes.
Does anyone have any experience with different resists for these processes or
can anyone recommend one?

Marco

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Dipl.-Ing. Marco Doms

Wissenschaftlicher Mitarbeiter
Arbeitsbereich Mikrosystemtechnik 4-07
Technische Universität Hamburg-Harburg

Eissendorfer Str. 42
21073 Hamburg