Dear Emeline,

this kind of wafers can be bonded as the standard Si-Pyrex wafers. The
process parameters have not to be changed.

Best Regards,
Margarete Zoberbier

----------------------------------------------------
SUSS MicroTec
Applications Center RSC Europe
Margarete Zoberbier
Schleissheimer Str. 90
85748 Garching
Germany
Phone   +49 89 32007 - 380
Fax     +49 89 32007 - 390
email   m.zoberbier@suss.de


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Message: 6
Date: Fri, 26 Mar 2004 10:17:20 +0100
From: Emeline MERY 
Subject: [mems-talk] anodic bonding with porous silicon and pyrex
To: mems-talk@memsnet.org
Message-ID: <4063F520.10104@insa-lyon.fr>
Content-Type: text/plain; charset=ISO-8859-1; format=flowed

Hello,

I would like to know if someone has already done anodic bonding with
porous silicon and pyrex. Does it function like si / pyrex anodic
bonding or conditions must be changed?

all the best,

Emeline MERY

Doctorante
Laboratoire de Physique de la Matière (LPM)
UMR CNRS 5511
INSA de Lyon
7 avenue Jean Capelle, bât. Blaise Pascal
69621 VILLEURBANNE CEDEX
FRANCE
Tél. : (33) 4 72 43 87 95
Fax : (33) 4 72 43 60 82





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