I have spent the last two years building and testing a new type deep silicon
etch tool on a standard Lam platform. The system is capable of running either
100mm or 150mm wafers using an SF6+O2 process that makes for a good anisotropic
etch for feature sizes from 10 micron-100 micron and a good profile to etch
depths to 150 microns using photoresist. I am looking for someone who might be
interested in doing a joint project together using my Crystal System at your
site. This would only be for someone in the US. My company will provide support
and warranty for the right circumstances. Please contact me via email or call at
602-206-6154. Thanks Bob Henderson