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MEMSnet Home: MEMS-Talk: Re: problems of release/etching process
Re: problems of release/etching process
1998-11-20
Uthara Srinivasan
1998-11-17
Kenneth A. Honer
1998-11-18
zhang liuqiang
1998-11-18
zhang liuqiang
1998-11-20
Uthara Srinivasan
Re: problems of release/etching process
Uthara Srinivasan
1998-11-20
Hello,

A paper on the application of SAMs for stiction reduction is the
following:

U. Srinivasan et al. "Alkyltrichlorosilane-Based Self-Assembled Monolayer
Films for Stiction Reduction in Silicon Micromachines," Journal of
Microelectromechanical Systems, Vol. 7, No. 2, June 1998, p. 252-260.

There is also a paper on SAMs for lubrication of MEMS in the Hilton Head
1998 Conference Digest.

I'd be happy to write more details on the exact procedure or fax you the
article if you'd like.

Thanks,
Uthara Srinivasan

On Wed, 18 Nov 1998, zhang liuqiang wrote:

> Hi, my friend,
>
> Thanks for your advice, it is really a good idea. I have considered
> self-assembly monolayers (SAMs), and I know that it is a popular means for a
> better release abroad. However, in China, I've never heard of any practical
> use; therefore, could you tell me something about where to get and how to use
> such a material, the more detailed, the better.
>
> Thanks,
>
> Liuqiang Zhang
>
>
> Uthara Srinivasan wrote:
>
> > Hello,
> >
> > Have you considered coating the devices with self-assembled monolayers
> > (SAMs)? That should solve the stiction problems and doesn't require use of
> > supercritical drying.
> >
> > good luck,
> > Uthara Srinivasan
> >
> > On Mon, 2 Nov 1998 zhanglq@itsvr.sim.ac.cn wrote:
> >
> > > Dear colleague,
> > >
> > > I am working on the processing of a MEMS-based infrared image device,
> > > everything goes through well but the release of the device. Here are
> > > the problems: first, since the micro-machined structures are very
> > > flimsy, I couldn't stir the resolution violently, thus bubbles arising
> > > in the etching process of SiO2 not only prevented the uniform etching
> > > but also destroyed the structures; second, as I haven't a
> > > supercritical desiccator or a squeezing drier, after removing of the
> > > sacrificial layers, the suspending structure always corrupted because
> > > of the capillary forces.
> > >
> > > Are there any good ideas on the release/drying process? Your help is
> > > highly appreciated.
> > >
> > > Best regards.
> > >
> > > Liuqiang Zhang, Ph.D. Candidate,
> > >
> > > State Key Laboratories of Transducer Technology,
> > >
> > > Shanghai Institute of Metallurgy, Academia Sinica
> > >
> > > Email: zhanglq@itsvr.sim.ac.cn
> > >
> > > Tel: +86-21-625-11070 ext. 8603
> > >
> > >
>
>
>
>


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