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MEMSnet Home: MEMS-Talk: Surface protection during CMP
Surface protection during CMP
2004-04-16
pskoundinya
2004-04-19
Jeff Simkins [simkinjr]
2004-04-21
JGir55@aol.com
Surface protection during CMP
pskoundinya
2004-04-16
Hi,
When I am polishing one side of a 4-inch Silicon wafer, the other side of the
wafer is ending up with slurry deposits after each polishing cycle. I am
thinking about protecting the other side of the wafer from slurry deposits and
stains by covering it with some adhesive tape that can be peeled off after
entire wafer polishing. This would protect structures from slurry deposits. Does
anyone know of any standard covering tapes that industry uses to protect the
wafer surfaces during polishing? I would appreciate any suggestions.

Thanks,
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