We are currently in need of a good wet silicon etch process. Can some of you
recommend for me what conditions and chemistry would be best for a thru the
wafer etch. I also would like a reference to better understand what is possible
for this type of wet etching.Thing such as what silicon crystal orientation
produces the most anisotropic profile would be helpful. I also would like to
know some of the parameters like size of tank for 50-4" wafers to be processed
at once, does this require recirculation from a 10 or 20 gallon reservoir,
temperature, and concentration (formula) of either KOH or TMAH whichever you
recommend. Your help is appreciated

Bob Henderson