Dear all,

I am making a micropump by a quartz chip with a row of heaters and a
plastic (acrylic) plate with a channel and input/output port.
For previous work, I span a very thin PDMS layer  (a few micron) on the
plastic plate before laser-machining the channel and ports, then align it
with the chip under microscope and use a hard plate to press them
together.

It works fine at the beginning but starts to leak after several days' use
since there is no perminent bonding between the chip and the PDMS layer.

Now, I want to improve the bonding. Anybody has any suggestion?

The quartz chip was already wire-bonded to a PC board and the thinkness
of the platinum wire is 200 nm. I don't have O2 plasma but I do have an
oven.

Thanks a lot

Zhizhong Yin
Phone#: 410-516-8525(o)          Johns Hopkins University
        410-662-4760(h)          223 Latrobe Hall
email:zzyin@titan.me.jhu.edu     3400 N. Charles Street
homepage:www.me.jhu.edu/~zzyin   Baltimore MD 21218
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