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MEMSnet Home: MEMS-Talk: DIP package
DIP package
2004-05-22
[email protected]
DIP package
[email protected]
2004-05-22
Hello Vikas,

The plastic mold compound can be removed with drops or fumes of nitric acid.
There is equipment available  (called decapping systems) that can control the
amount of compound that is desolved away.  I suggest that you google IC
decapping equipment to see the details.

Good luck,

Jim

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