Debasish,

        There are many methods for bonding these two items together.  A lot
depends on what your requirements are.
- What is the required alignment accuracy?
- Wafer level or device level?
- Do you need hermeticity?  If so, how much?
- Is the required connection electrical, mechanical, or both?
- Are these devices sensitive to pressure, force, or temperature?
- Are there any post-processing steps that use harsh chemicals or extreme
temperatures?

There are a variety of options ranging from polymer bonds to eutectic bonds.
Feel free to contact me and we can walk through some different possibilities.

Best Regards,
Brian Douglas
Applications Engineer - Bonders
SUSS Microtec Inc.
Bdouglas@suss.com
(802)244-5181 x-202

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Dear Sir/Madam,

        I am febricating an Accelerometer.I have two part one is cantilever with
tip and other is Base electrode assembly.I have to bond ,two parts. Could you
please tell me the best bonding method between gold layer(1000A)and SiO2
layer(0.8 um).

Thanks & Regards

Debasish PaulIndiatimes Email now powered by APIC Advantage. Help!
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