usually thin  Ti or Cr layer (~ 200 A)acts as good adhesion layer.
 Dipankar

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--------- Original Message ---------

DATE: Wed, 02 Jun 2004 10:41:25
From: "dpkgp" 
To: 
Cc:

> Dear Sir/Madam,
>
>        I am febricating an Accelerometer.I have two part one is cantilever
with tip and other is Base electrode assembly.I have to bond ,two parts. Could
you please tell me the best bonding method between gold layer(1000A)and SiO2
layer(0.8 um).
>
>Thanks & Regards
>
>Debasish PaulIndiatimes Email now powered by APIC Advantage. Help!
>HelpClick on the image to chat with me
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