Dear All,

Does anybody out there know what is the best approach for polyimide etching?
What I need to etch is PI-2555 from DuPont and the coated PI-2555 layer is
about 1 micron.

I only have tried dry etching (RIE) with CF4:O2, which gave me a very slow
etching rate. FYI, the photoresist and developer I used are AZP4210 and
AZ400K, respectively.

Now I am about ready to try RIE again using just O2, but not quite sure how
much of a difference it's going to make in terms of etching rate. So, any
information regarding this will be helpful for me so that I don't have to
repeat somebody else's failure. :)

Thanks a bunch!

dongmei

Dongmei Li
Postdoctoral Fellow
University of Colorado
Department of Chemical and Biological Engineering
Campus Box 424
Boulder, CO 80309
303-492-8547 (office)