Hi Josef,

I like to use a saw to pre-scribe wafers which I want to break later on.  I use
a normal dicing saw but only cut partially through the wafer on the backside.
Then do my normal spinning, etc. for photo-litho.  When I want to break the
wafer later on the fracture lines are already defined.  I like this technique
because all of the mess and heat of dicing is done with before any of the photo-
litho.

Cheers,  Marie