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MEMSnet Home: MEMS-Talk: Photoresist removal after ion milling
Wafer bonding
2004-06-16
Andrea Tombros
2004-06-16
Aaron M. Cooke
Wafer bonding with glass
2004-06-17
Kirt Williams
Photoresist removal after ion milling
2004-06-17
Robert Dean
2004-06-17
Brent Garber (2 parts)
Photoresist removal after ion milling
Brent Garber
2004-06-17
Dear Robert,

I'm sure you must have a reason for using NMP.  People tend to use it as an
acetone replacement to reduce fire hazards and it is reclaimable.  No one uses
it because it works so well.
Can you use any common resist strippers or EKC's nophenol 922?

Brent

Robert Dean wrote:

> Hello,
>
> We are ion milling a thin layer of Au/Cu on a polymeric substrate, while
> using photoresist (AZ5124EIR) as the etch mask.  The ion milling works very
> well for etching the Au and Cu.  However, the process results in
> crosslinking of the photoresist where we cannot remove it from the
> remaining Au/Cu traces on the substrate, even through heated NMP based
> stripper baths for 20 hours.  Unfortunately, ashing would damage the
> polymeric substrate.  Does anyone have a suggestion on how to remove the
> remaining photoresist?
>
> Sincerely,
>
> Robert Dean
> Auburn University
>
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