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MEMSnet Home: MEMS-Talk: Adhesion layer for sputtered Copper
Adhesion layer for sputtered Copper
2004-06-20
Dipankar Ghosh
Adhesion layer for sputtered Copper
Dipankar Ghosh
2004-06-20
Hi all,
 does any of you have any experience with using Ir (Iridium) as an adhesion for
for sputtered Cu. I know that most people use Cr, Ti. Are there any alternatives
?
        Thanks
             Dipankar


---

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--------- Original Message ---------

DATE: Fri, 18 Jun 2004 10:57:57
From: "Dipankar Ghosh" 
To: "General MEMS discussion" 
Cc:

>Hi all,
>
>         I am trying to sputter thick Cu ( 1 um) in a DC sputtering system.my
sputtering conditions are as follows :-
>
>base pr- 10 exp(-6) torr
>
>chamber pr -10 m torr
>
>Ar gas flow - 10 sccm.
>
>power - 250 W
>
>Target to substrate distance - 5 cm.
>
>my problem is that the resistivity of my deposited Cu is very high (24 micro
ohm cm) which is about 15 times the bulk resistivity of Cu( 1.6 micro ohm cm).
>
>does anybody any any experience with deposition of thick Cu with low
resistivity values.pls let me know.
>       Thanks in advance,
>                  Dipankar
>
>OFFICE ADDRESS :-
>
>MATERIALS RESEARCH CENTER,
>ROOM 322 , RB-1,
>1001 CAPABILITY DRIVE,
>CENTENNIAL CAMPUS, NCSU,
>RALEIGH ,
>NC 27695-7919
>USA
>
>PH- 919 515 5049
>FAX- 919 515 3419
>
>
>
>
>
>
>
>
>
>
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