Hi Mahvir

Is the membrane that is cracking released or is it cracking where it is attached
to the silicon. If it is the released area that is cracking then you might
consider releasing the membrane after dicing. If this would solve the problem I
can discuss with you how you can use XeF2 to remove the silicon under the
membrane while the diced wafer is still on the dicing tape.

David Springer
XACTIX, Inc.

>>  Hi all,

 >>  I am looking for a way to dice my silicon wafer with deep etched pockets
 >>  with a micron thick 8 mm by 8 mm silicon nitride membrane on one side. I
 >>  tried to use the wax to fill in the cavities and dice. But, I observed
 >>  the membranes break. Our dicing saw uses a high pressure water stream to
 >>  cool the diamond blade. I would appreciate if anyone has any suggestions.

 >>  Thanks in advance,
 >>  -Mahavir Sanghavi
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