I would suggest dicing prior to releasing the membrane or separate the
dice by etching, rather than with a saw.

Roger Shile

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Mahavir Sanghavi
Sent: Tuesday, July 06, 2004 9:00 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Silicon nitride membrane : wafer dicing problem

Hi all,

I am looking for a way to dice my silicon wafer with deep etched pockets
with a micron thick 8 mm by 8 mm silicon nitride membrane on one side. I
tried to use the wax to fill in the cavities and dice. But, I observed
the membranes break. Our dicing saw uses a high pressure water stream to
cool the diamond blade. I would appreciate if anyone has any
suggestions.

Thanks in advance,
-Mahavir Sanghavi
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