Be aware that for any barrier layer, you need to be sure you can etch it if
that is part of your process.  Pt, as I understand it, can be difficult to
etch.


David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of Zhimin J Yao
Sent: Thursday, July 15, 2004 4:12 PM
To: General MEMS discussion
Subject: Re: [mems-talk] metal resistance after anodic bonding







Shay,

Cr diffuses into Au easily specially at 370 C and above temperatures.  The
alloy has a higher resistivity.  You can add a layer of Pt (300-400 A) in
between Cr and Au to prevent diffusion.  Or consider using Ti or TiW
instead of Cr if your process permits.

Good luck,
Zhimin




                      Shay Kaplan
                                 To:
                      Sent by:                   cc:
                      mems-talk-bounces@         Subject: [mems-talk] metal
resistance after anodic bonding
                      memsnet.org


                      07/15/2004 07:08
                      AM
                      Please respond to
                      General MEMS
                      discussion





Hi,
We have been using Cr/Au 1500/2500 evaporated conductors on Pyrex for
devices that are latter anodicaly
bonded.
We have noticed a 10 fold increase in resistance following exposure to 370
deg for 30 min at nitrogen
ambient.
analysis showed that the chrome only does not change it's resistance.

anybody out there know what is causing this? any idea how to avoid it?
better two metal option?

thanks
shay